A*STAR’s IME advances 3D packaging with chip-on-wafer bonding technologies

It enables semiconductor firms to develop commercially-viable capabilities.

With the rising demand for smaller IC packages with increased functionalities, there is a pressing need for more advanced bonding technologies.

According to A*STAR’s Institute of Microelectronics (IME), it has formed a Chip-on-Wafer (CoW) Consortium to enable semiconductor firms to develop commercially-viable capabilities for making 3D chipsets.

The consortium focuses on enhancing a Chip-on-Wafer bonding technique with the use of Copper-Copper (Cu-Cu) diffusion bonding technology.

The members of the new consortium are ON Semiconductor, KLA-Tencor, Panasonic Factory Solutions Asia Pacific (Panasonic), Singapore Epson Industrial Pte Ltd (Plating Division), Tera Probe, Inc, and Tokyo Electron Ltd.

Prof. Dim-Lee Kwong, Executive Director of IME, said, “We are excited to be taking the lead in this research collaboration with leading industry players by equipping them with a ready Chip-on-Wafer packaging technology. We will continue to work towards pushing the frontiers of 3D chip integration and drive market competitiveness in the value chain.”